Thermal Potting Adhesive

Product Introduction

Thermal conductive potting adhesive is a low viscosity, flame-retardant, two component addition molding silicone thermal conductive potting adhesive that can be cured at room temperature or heated. It has the characteristic of faster curing at higher temperatures,

It is made by adding thermal conductivity to ordinary sealing silicone or adhesive silicone, and can be applied to the surfaces of materials such as PC, PP, ABS, PVC, and metals.

packing of products

Packaging: 10KG/barrel, 20KG/barrel

Product characteristics

The product has high thermal conductivity, with a thermal conductivity coefficient of up to 3W/m · K

The product has high reliability and stable performance

The product has low viscosity, good flowability, good filling effect in narrow gaps, and fast exhaust bubble speed

The product has high insulation and excellent flame retardancy

Product Application

Thermal conductive potting adhesive is suitable for insulation and thermal sealing of products such as electronics, power modules, high-frequency transformers, connectors, sensors, electric heating parts, and circuit boards. It is widely used in fields such as electronics, optoelectronics, consumer electronics, automotive electronics, LED lighting, etc.