Thermal Conductive Gap Pad

THERMAL CONDUCTIVE GAP PAD

Product Description:

Dingtai Thermal Conductive Gap Pads are used for the joint between the heat sink and electronic devices, 

and are suitable for covering uneven or irregular component surfaces,can specify the proper thermal gap pads 

for each unique thermal management pad requirement according to different thermal needs of customers.

Product Feature:

 u Widely range of thermally conductivity

 u High-thermal conductivity

 u Excellent insulation under high Voltage

 u Highly conformable to uneven and rough surfaces

 u Thermal Conductive Gap Pads can be customized

Product Selection Table:

Product Applications:

Dingtai Thermal Conductive Gap Pads are widely used in consumer electronics industry, new energy automobile industry, automotive electronics industry, 

optical module industry, security industry, such as:

●The bottom or frame of radiator

●High speed hard-disk drive

●RDRAM memory module

●Automobile engine control device

●IGBT modules

●Between a semiconductor and heat sink

●Communication hardware portable electronic device

Storage and Transportation:

Store in a cool, dry, well-ventilated place:

Temperature 5~35℃; Humidity 0~65%

This product is non-toxic and is stored and transported by non-dangerous goods.

Warranty:

•Dingtai offer 12 month's warranty or any other warranty period specified in the contract for the product from the date of purchase.

•Invoice or shipment bill is required to claim the warranty.

•The warranty policy only requires manufacturer to repair the defective product or send substitute for replacement.

•Warranty doesn't cover the defect caused by inappropriately use.

•Labor, electricity cost and other related cost will not be covered by the manufacturer warranty policy.